Credits: 3
An overview of thermal management for micro/power electronics systems and helps engineers understand emerging thermal technologies. It will include the following topics: the background of electronics packaging, thermal design of heat sinks, single-phase and multiphase flow in thermal systems, two-phase heat exchange devices for portable and high-powered electronic systems, and computational fluid dynamics for the design of thermal systems.
Description
Credit only granted for: ENME765 or ENME808D.
Formerly: ENME808D.
Additional information: Students must have prior coursework similar to the content offered in undergraduate courses ENME331, ENME332, and ENME473.
Semesters Offered
Spring 2026
Testudo