HONORS AND AWARDS
1. 2021 Distinguished University Professor. The title of Distinguished University Professor is the highest academic honour bestowed by the University of Maryland.
2. 2020 Ranking of Top 1000 Scientists in the field of Computer Science and Electronics: Ranked 406 in the world ranking and 264 in United States
3. IEEE Eastern Region Outstanding Professional Award: “For technical contributions and leadership in the area of electronics reliability, safety and sustainability” (2020)
4. Awarded Fellow: ASM-International (2020).
5. Recognized as a Highly Cited Researcher in 2019 by the Web of Science Group. For his exceptional research influence, demonstrated by the production of highly cited papers that rank in the top 1% by citations in 2019 in Web of Science.
6. Awarded: PHM Lifetime Achievement Award, PHM Society, Sept. 2019.
7. Awarded: IEEE CPMT Technical Field Award (2016).
8. Awarded: 2015 Applied Energy Award – most highly cited research paper. Xing, Y., W. He, and M. Pecht, “State of Charge Estimation of Lithium-ion Batteries Using the Open-circuit Voltage at Various Ambient Temperatures,” Applied Energy, Vol. 113, pp. 106–115, Jan. 2014.
9. Best Student Paper Award of Conference (2016): N. Jordan Jameson, Kai Wang, Carlos Morillo, Michael H. Azarian, and Michael Pecht, “Health Monitoring of Solenoid Valve Electromagnetic Coil Insulation under Thermal Deterioration,” Proceedings of MFPT 2016/ISA's 62nd IIS, Dayton, OH, May 24-26, 2016.
10. Awarded: 2016 Chinese Academy of Sciences President's International Fellowship.
11. Best paper award: Fan, J., ChengQian, Fan, X., Zhang, G., and M. Pecht, “In-situ Monitoring and Anomaly Detection for LED Packages Using a Mahalanobis Distance Approach,” The First International Conference on Reliability System Engineering & Prognostics and System Health Management Conference-Beijing (2015 ICRSE & PHM-Beijing), Beijing, China, October 23, 2015.
12. Awarded the distinction of “Honorary Professor” by the Harbin Institute of Technology (HIT) in Harbin, China, on July 16, 2015. The Honorary Professor award was granted to Prof Pecht for his technical expertise batteries and for his involvement with HIT in battery research. HIT was established in 1954 and is a member of the prestigious C9 League of Chinese universities. HIT was ranked 10th in the ranking of “Best Global Universities for Engineering” by U.S. News & World Report in 2015.
13. Awarded: 2015 Distinguished Scientist: Chinese Academy of Sciences President’s International Fellowship.
14. IEEE Access was awarded the 2015 PROSE Award winner in the subject category of “Journal/Best New STM (Scientific, Technical, and Medical).” Prof. Pecht is the Editor-in-Chief of IEEE Access. The American Publishers Award for Professional and Scholarly Excellence (PROSE) annually recognize the very best in professional and scholarly publishing by bringing attention to distinguished books, journals, and electronic content. IEEE Access was also a finalist for the Award for Excellence in Physical Sciences and Mathematics.
15. “Academic Excellence Award” by the Electronics Components Industry Association (ECIA). The award is used to recognize outstanding academic projects ‘that reference the application of advanced technologies for passive electronic components’. Peter, Anto, Michael H. Azarian, Michael Pecht, “Step Stress Testing of Electric Double Layer Capacitors,” International Capacitor and Resistor Technology Symposium, Santa Clara, CA, April 2014.
16. 2014 Corporate Connector of the Year from the University of Maryland, College Park: The Corporate Connector Award celebrates those individuals or units on campus that do the most to promote and connect UM with the private sector to advance research, partnerships, and scholarship.
17. 4th most cited article in Transactions of the Institute of Measurement and Control over five years (2009 -2014): Pecht, M. and Gu, J., “Physics-of-failure-based Prognostics for Electronic Products,” Trans. of the Institute of Measurement and Control, Vol. 31, No. 3/4, pp. 309–322, 2009, DOI: 10.1177/0142331208092031
18. 2013: Received gift of $750k for research into automotive reliability from Hagans, Berman, Sobol, Shapiro LLP
19. 2013 IEEE Educational Activities Board/Standards Association (EAB/SA) Standards Education Award “for continued leadership in developing and promoting standards education in the field of reliability engineering.”
20. Outstanding Paper Award (2013): for Williard, N., W. He, M. Osterman, and M. Pecht, “Reliability and Failure Analysis of Lithium Ion Batteries for Electronic Systems,” International Conference on Electronic Packaging Technology and High Density Packaging (ICEPT-HDP), Aug. 2012.
21. University of Wisconsin-Madison College of Engineering Distinguished Achievement Award (2013). In recognition of the eminent Professional contributions as a “world-renowned professional engineer and educator whose innovations in reliability and prognostic methods have made a significant contribution to the field of electronics”
22. Most downloaded article in Microelectronics Reliability for the years 2012, 2013, 2014: Chang, M-H, D. Das, P.V. Varde, and M. Pecht, “Light Emitting Diodes Reliability Review,” Microelectronics Reliability, Vol. 52, No. 5, pp. 762–782, May 2012.
23. First Place, IEEE PHM 2012 Prognostic Challenge, Academic Category (2012): for successfully extracting degradation features from vibration data and developing fault propagation models to accurately predict the remaining useful life of bearings. The CALCE team included Arvind Vasan, Edwin Sutrisno, Wei He, Moon-Hwan Chang, Jing Tian, Yan Ning, Hyunseok Oh, and Surya Kunche.
24. Best Student Paper Award of Conference (2012): for Chauhan, P., M. Osterman, and M. Pecht, “Canary Approach for Monitoring BGA Interconnect Reliability under Temperature Cycling,” MFPT 2012: The Prognostics and Health Management Solutions Conference, Dayton, OH, April 24–26, 2012.
25. Overall Best Conference Paper from Academia (2011): for Haddad, G., P. Sandborn, and M. Pecht, “Method for Valuating Options Arising in PHM,” Proc. of 2011 IEEE PHM Conference, Denver, CO, June 2011.
26. Inducted to 2011 Innovation Hall of Fame at the A. James Clark School of Engineering, University of Maryland (2011): for pioneering innovations in advanced reliability and prognostic methods for electronics.
27. Maurice Simpson Technical Editors Award for best paper of the 2010 year (2010): for Gu, J. and M. Pecht, “Prognostics and Health Assessment Implementation for Electronic Products,” J. of the IEST, Vol. 53, Num 1, pp. 44-58, April 2010.
28. Indian Society of Reliability, Maintainability and Safety Lifetime Reliability Achievement Award (2010): On Dec. 16, 2010 in Mumbai, India, Dr. Pecht received the first and highest reliability award of its kind of India for his “significant contributions in the area of product reliability, prognostics & health management of electronic components.”
29. CPMT Society Exceptional Technical Achievement Award (2010): to recognize for exceptional technical achievement in the fields encompassed by the CPMT Society. “Dr Pecht is recognized worldwide for his seminal contributions in the area of electronics reliability from which he has developed a new and significant field of prognostics for electronics. This includes models that enable in-situ assessment of the deviation or degradation of a product from expected normal operating conditions and the prediction of the future state of reliability of that product. Michael’s contributions in this area span more than 20 years and his subject matter expertise is disseminated in a book, several book chapters, handbooks, numerous articles, invited talks and short courses presented worldwide.”
30. Society of Automotive Engineering (SAE) Fellow (2010): for his research and promotion of the reliability of the electronic parts and systems used in automotive and aerospace applications.
31. National Defense Industrial Association award (2009) for CALCE for demonstrating outstanding achievement in the practical application of Systems Engineering principles, promotion of robust systems engineering principles throughout the organization, and effective systems engineering process development.
32. University of Maryland Outstanding Faculty Research Award (2009): to recognize research contributions and exceptionally influential research accomplishments by engineering faculty.
33. Outstanding Paper, I-Connect (Connecting the Global Electronics Supply Chain), (2009): for the paper, He, X., M. Azarian, and M. Pecht, “Comparative Assessment of Electrochemical Migration on PCBs with Lead-Free and Tin-Lead Solders,” SMT Online Magazine.
34. The Alexander Schwarzkopf Prize for Technological Innovation (2008): awarded to National Science Foundation (NSF) Industry/University Cooperative Research Centers that have had a significant impact on the world. CALCE won the award for its research on physics-of-failure reliability analysis methods and advanced supply chain management concepts for electronic products and systems.
35. Best Paper Award (2008): for the 62nd Meeting of the Society for Machinery Failure Prevention Technology. Gu, J., Barker D., and M. Pecht, “Prognostics of Electronics under Vibration Using Acceleration Sensors,” Proceeding for 62nd Meeting of the Society for Machinery Failure Prevention Technology (MFPT), Virginia Beach, VA, May 2008, pp. 253-263.
36. Maurice Simpson Technical Editors Award (2008) for best 2007 article in IEST. Sony Mathew, Diganta Das, Michael Osterman, Michael Pecht, Robin Ferebee, and Joseph Clayton, for their paper, “Virtual Remaining Life Assessment of Electronic Hardware Subjected to Shock and Random Vibration Life Cycle Loads,” Journal of the IEST, Vol. 50, No. 1, pp. 86–97, April 2007.
37. Japan Society for the Promotion of Science Fellowship (2008): for research in prognostics in electronics.
38. IEEE Reliability Society’s Lifetime Achievement Award (2007): recognizes Prof. Pecht’s long-term contributions to the Reliability Society, reliability research, and reliability education, all benefiting the reliability community.
39. European Micro and Nano-Reliability Award (2007): for outstanding contributions to reliability research.
40. Distinguished International Service Award (2006) for significant contributions to the development of international institutional programs at the University of Maryland; and a distinguished international career.
41. Grand Fellowship of the Mirce Academy, England (2005): the highest award that the Academy can bestow upon an individual in recognition of their unique contribution to the understanding and/or predicting of the motion of functionability through system life, at the global level of significance.
42. IEEE Best Paper of the Year (2004) Award: for paper titled “Characterization of Hygroscopic Swelling Behavior of Mold Compounds and Plastic Packages.”
43. The Royal Society, United Kingdom, Kan Tong Po Electrical Engineering Visiting Professorship Award at City University in Hong Kong (2002).
44. George E. Dieter Chair Professor of Mechanical Engineering, for significant contributions to the reputation of the Department, College and University with the establishment of CALCE Electronic Products and Systems Center (2001).
45. IEEE Standards Award for chairing and developing IEEE Standard Methodology for Reliability Prediction and Assessment for Electronic Systems and Equipment #1413 (2000).
46. IEEE Standards Award for chairing and developing IEEE Reliability Program Standard #1332 (2000).
47. 3M Research Award for “research work in the electronics reliability area that has made significant contributions to the scientific understanding of material properties and their complex behavior” (1999).
48. ASME Electrical and Electronic Packaging Division (EEPD) Award “for outstanding contributions to the field of application of engineering mechanics to electronic packaging” (1999).
49. IEEE Undergraduate Teaching Award, “for the development and realization of a cross disciplinary educational program in Computer Aided Life Cycle Engineering (CALCE)” (1999).
50. Outstanding paper of the year for the Microelectronics Int’l Journal, “Popcorning in PBGA Packages during IR Reflow Soldering,” P. McCluskey, R. Munamarty, and M. Pecht, Vol. 42 Nr. 1, (1997).
51. ISHM/IEPS William D. Ashman Memorial Achievement Award (1997), “for his numerous contributions to academia and the electronics packaging industry.”
52. IEEE Reliability Society’s Annual Reliability Award (1996), “for his contributions to the IEEE Trans. on Reliability, his work with CALCE Electronic Packaging Research Center and his work on Reliability Standards.”
53. Faculty Achievement Award (April 1996), “in recognition of outstanding contributions to industrial research enabled by the Technology Initiatives Program.”
54. American Society for Quality Control: Reliability Division, Austin Bonis Award for the Advancement of Reliability Education (1996) for outstanding achievement in the advancement of reliability education.
55. Institute of Environmental Sciences Reliability Test and Evaluation Award (1996), “for vital contribution to the development and promotion of physics-of-failure modeling and analysis as a valuable reliability design and test process in the government, commercial and academic communities.”
56. ASME Fellow (1995), “for promoting the art, science, and practice of mechanical engineering.”
57. National Aeronautics Space Agency (NASA) certificate of “recognition of your significant contributions in the preparation and execution of the successful Second U.S. Microgravity Payload (USMP-2) Mission, launched on March 4, 1994.”
58. IEEE Fellow (1992), “for effectiveness in leadership in the development and realization of an exemplary program and successful efforts to raise the level of engineering excellence and practice within and without the organization.”
59. Int’l Electronic Packaging Society (IEPS) Educational Award “for excellence in research and education at the University of Maryland CALCE Electronics Packaging Research Center (1990).”
60. Best paper of the year (Maurice Simpson Technical Editors Award) for the Journal of the Institute of Environmental Sciences, “Reliability Prediction of Electronic Packages,” May/June 1990.
61. Best paper award, “How Failure Prediction Methodology Affects Electronic Equipment Design,” with C. Leonard, Power Conversion Conf., Long Beach, CA, Oct. 16–19, 1989.
62. Westinghouse Professor (1987-1988).
63. Visiting Scholar Award, Excellence in Reliability and Maintainability, Air Force Institute of Technology, Wright Patterson Air Force Base, Dayton, OH, June 15–July 10, 1987.
64. Outstanding Systems Engineering Faculty, (1986–1987), Systems Research Center, Univ. of Maryland.
65. Engineering Research Center’s University of Maryland, Technology Advancement Program (TAP) Award (1986).
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